-
1 silicon fusion bonding
з’єднання кремнієвих пластин методом сплавлення. Технологія з’єднання гідрофілізованих підкладок, зроблених з Si, окисленого кремнію і т.д. первиним водневим зв’язком між поверхнями і потім зв’язком Si-O-Si після відпалу при високій температуріEnglish-Ukrainian dictionary of microelectronics > silicon fusion bonding
-
2 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding
См. также в других словарях:
Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… … Wikipedia
Silicon — Not to be confused with the silicon containing synthetic polymer silicone. aluminium ← silicon → phosphorus C ↑ Si ↓ Ge … Wikipedia
Elmos Semiconductor — Infobox Company name = Elmos Semiconductor AG type = Public company foundation = 1984 location city = Dortmund location country = Germany location = locations = key people = area served = automotive industry = Electrical engineering products =… … Wikipedia
Mathematics and Physical Sciences — ▪ 2003 Introduction Mathematics Mathematics in 2002 was marked by two discoveries in number theory. The first may have practical implications; the second satisfied a 150 year old curiosity. Computer scientist Manindra Agrawal of the… … Universalium
Metalloid — 13 14 15 16 17 2 B Boron … Wikipedia
industrial glass — Introduction solid material that is normally lustrous and transparent in appearance and that shows great durability under exposure to the natural elements. These three properties lustre, transparency, and durability make glass a favoured… … Universalium
chemistry — /kem euh stree/, n., pl. chemistries. 1. the science that deals with the composition and properties of substances and various elementary forms of matter. Cf. element (def. 2). 2. chemical properties, reactions, phenomena, etc.: the chemistry of… … Universalium
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Hydrogen — This article is about the chemistry of hydrogen. For the physics of atomic hydrogen, see Hydrogen atom. For other meanings, see Hydrogen (disambiguation). ← hydrogen → helium … Wikipedia
clay mineral — any of a group of hydrous aluminum silicate minerals, as kaolinite, illite, and montmorillonite, that constitute the major portion of most clays. [1945 50] * * * Any of a group of important hydrous aluminum silicates with a layered structure and… … Universalium
Physical Sciences — ▪ 2009 Introduction Scientists discovered a new family of superconducting materials and obtained unique images of individual hydrogen atoms and of a multiple exoplanet system. Europe completed the Large Hadron Collider, and China and India took… … Universalium